Manufacturer and Supplier of Semiconductor Assembly Equipment for Auto Leadframe Loader, Degator System, Leadframe Trimming Machine, Multi Strips Loader and Unloader, Bulk loading System, Inline Test/ Laser Mark / Vision system, BGA Vision Inspection System, Auto Pellet Dispenser, Trim and Form System, Mold Mismatch and Off-Center Inspection System and etc. Expertise in Design & Fabrication Molds, Trim & Form System Die Sets and Tooling parts of Semiconductor products like BGA, QFN, QFP, LQFP, MSOP, PLCC, PDIP, SSOP, SOJ, SOIC, SIP, TSSOP, TSOP, SMD, SOD, SOT, TO, D Pak, D2 Pak and etc. Expertise in Supply Refurbished Used Equipments for Die Bonder, Wire Bonder, Auto Molding System, Molding Press, Tester and etc. Equipment Upgrading, Refurbishment Service, Spare Parts Supply.. We are regularly Selling: press, shinkawa wire bonder, auto frame loader, vision inspection, trim and form, mold, mold spare parts, pot, plunger. We are regularly Buying: press, bonder, tester, system, robot, cartesian robot. |
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